硅加工中的表征 电子书下载 PDF下载

硅加工中的表征
内容简介
  This volume is one of a series originally issued under anotherimprint. The other volumes in this series are as follows:Characterization of Catalytic Materialsisrael E. Wachs;Characterization of Metals and AlloysPaul H. Holloway and P. N Vaidyanathan;Characterization of CeramicsRona/d E. Loehman;Characterization of PolymersNed J. Chou, Stephen R Kowalczyk, Ravi Saraf, and Ho—Ming Tong;Characterization in Compound Semiconductor ProcessingGary McGuire and Yale Strausser;Characterization of Integrated Circuit Packaging MaterialsThomas M. Moore and Robert G. McKenna;Characterization of Composite MaterialsHatsuo Ishida;Characterization of Tribological MaterialsWilliam A. Glaeser;Characterization of Optical MaterialsGregory J. Exarhos;Characterization of Organic Thin FilmsAbraham Ulman.
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